Title:
ADHESIVE FILM FOR CIRCUIT CONNECTION, AND CIRCUIT CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/138747
Kind Code:
A1
Abstract:
This method for manufacturing a circuit connection structure comprises: a step for preparing an adhesive film for circuit connection, which includes a first adhesive layer containing conductive particles and a second adhesive layer provided on the first adhesive layer, the flow rate of the first adhesive layer being 130-250%; a step for arranging a first circuit member having a first electrode and a second circuit member having a second electrode such that the first electrode and the second electrode oppose each other; and a step for thermocompression bonding the first circuit member and the second circuit member in a state in which the adhesive film for circuit connection is interposed between the first circuit member and the second circuit member such that the first adhesive layer is the first circuit member side and the second adhesive layer is the second circuit member side, wherein, in the step for thermocompression bonding, the first electrode and the second electrode are electrically connected to each other via conductive particles to form electrode connection portions, the first adhesive layer is curved so as to protrude toward the first circuit member side or the second circuit member side between adjacent electrode connection portions, and the adhesive film for circuit connection is cured.
Inventors:
YAMAZAKI TOMOHARU (JP)
ICHIMURA TAKAYUKI (JP)
KOBAYASHI RYOHTA (JP)
ICHIMURA TAKAYUKI (JP)
KOBAYASHI RYOHTA (JP)
Application Number:
PCT/JP2021/047653
Publication Date:
June 30, 2022
Filing Date:
December 22, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J9/02; C09J7/35; C09J11/04; C09J11/06; C09J133/00; C09J163/00; H05K3/32; H05K3/36
Domestic Patent References:
| WO2019050006A1 | 2019-03-14 |
Foreign References:
| JP2003187885A | 2003-07-04 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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