Title:
ADHESIVE FILM, AND CONNECTION STRUCTURE AND CONNECTING METHOD FOR CIRCUIT MEMBER
Document Type and Number:
WIPO Patent Application WO/2008/056773
Kind Code:
A1
Abstract:
Disclosed is an adhesive film wherein a conductive adhesive layer containing
a conductive particle and an insulating adhesive layer are laminated. When
this adhesive film is heated and pressed in the lamination direction under certain
conditions, the value C/D obtained by dividing the area C of the major surface
of the cured insulating adhesive layer by the area D of the major surface of the
cured conductive adhesive layer is 1.2-3.0.
Inventors:
TOMISAKA KATSUHIKO (JP)
TAKETATSU JUN (JP)
TAKETATSU JUN (JP)
Application Number:
PCT/JP2007/071800
Publication Date:
May 15, 2008
Filing Date:
November 09, 2007
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
TOMISAKA KATSUHIKO (JP)
TAKETATSU JUN (JP)
TOMISAKA KATSUHIKO (JP)
TAKETATSU JUN (JP)
International Classes:
H01R11/01; C09J7/00; C09J9/02; C09J163/00; C09J171/10; H01L21/60; H05K3/32
Foreign References:
| JPH08279371A | 1996-10-22 | |||
| JP2005194413A | 2005-07-21 | |||
| JP2007217503A | 2007-08-30 | |||
| JP2002201450A | 2002-07-19 |
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (Ginza First Bldg.10-6, Ginza 1-chom, Chuo-ku Tokyo 61, JP)
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