Title:
ADHESIVE FILM AND FLEXIBLE METAL LAMINATED PLATE
Document Type and Number:
WIPO Patent Application WO/2015/080260
Kind Code:
A1
Abstract:
To provide: an adhesive film in which a polyimide film and a fluorine-containing resin layer are directly laminated and the occurrence of swelling (foaming) in an atmosphere corresponding to solder reflow at a high temperature is minimized; and a flexible metal laminated plate. An adhesive film characterized in that: a fluorine-containing resin layer containing a fluorine-containing copolymer (A) is directly laminated on one or both surfaces of a polyimide film; the fluorine-containing copolymer (A) has a melting point of 280-320ºC, exhibits melt moldability, and has at least one functional group selected from the group comprising carbonyl-group-containing groups, hydroxy groups, epoxy groups, and isocyanate groups; and the fluorine-containing resin layer has a thickness of 1-20 μm.
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Inventors:
HOSODA TOMOYA (JP)
NISHI EIICHI (JP)
SASAKI TORU (JP)
MATSUOKA YASUHIKO (JP)
KASAI WATARU (JP)
NISHI EIICHI (JP)
SASAKI TORU (JP)
MATSUOKA YASUHIKO (JP)
KASAI WATARU (JP)
Application Number:
PCT/JP2014/081602
Publication Date:
June 04, 2015
Filing Date:
November 28, 2014
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
B32B15/08; B32B15/082; B32B27/30; B32B27/34; C08F214/18; C09J7/22; C09J7/30; C09J127/12; C09J127/18; H05K1/03; H05K3/38
Domestic Patent References:
| WO2006067970A1 | 2006-06-29 |
Foreign References:
| JP2005023261A | 2005-01-27 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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