Title:
ADHESIVE FILM FORMATION COMPOSITION, ADHESIVE FILM, LAMINATE, PRODUCTION METHOD FOR LAMINATE, PRODUCTION METHOD FOR PATTERN, AND PRODUCTION METHOD FOR SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2021/060339
Kind Code:
A1
Abstract:
An adhesive film formation composition that is for imprinting. The adhesive film formation composition includes a resin that has side chains that have specific aromatic rings and polymerizable functional groups. The specific aromatic rings are unsubstituted aromatic rings or aromatic rings that have one or more substituents that each have a formula weight of no more than 1000. Less than 3 mol% of the polymerizable functional groups are polymerizable functional groups that include a heterocycle. An adhesive film, a laminate, a production method for a laminate, a production method for a pattern, and a production method for a semiconductor element that make use of the adhesive film formation composition.
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Inventors:
SHIMOJU NAOYA (JP)
HAKAMATA AKIHIRO (JP)
HAKAMATA AKIHIRO (JP)
Application Number:
PCT/JP2020/035940
Publication Date:
April 01, 2021
Filing Date:
September 24, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B27/00; B32B27/30; C08F299/00; H01L21/027
Domestic Patent References:
| WO2019156008A1 | 2019-08-15 | |||
| WO2019172156A1 | 2019-09-12 | |||
| WO2016031879A1 | 2016-03-03 | |||
| WO2018190337A1 | 2018-10-18 | |||
| WO2020059603A1 | 2020-03-26 | |||
| WO2019188881A1 | 2019-10-03 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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