Title:
ADHESIVE FILM AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2005/113696
Kind Code:
A1
Abstract:
Disclosed is an adhesive tape serving as a dicing tape in a dicing step which has excellent dicing properties and pick-up properties. Also disclosed is a bonding tape exhibiting excellent bonding reliability in a step for bonding a semiconductor element and a supporting member. Specifically disclosed is an adhesive film including a layer wherein an adhesive layer (A) containing an olefin polymer and another adhesive layer (B) are directly joined together. The adhesive film is characterized in that the 180&ring peel strength between the layer (A) and the layer (B) is not more than 0.7 N/10 mm.
Inventors:
TAKAMATSU NOBUHIRO (JP)
AIHARA SHIN (JP)
AIHARA SHIN (JP)
Application Number:
PCT/JP2005/008132
Publication Date:
December 01, 2005
Filing Date:
April 28, 2005
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
TAKAMATSU NOBUHIRO (JP)
AIHARA SHIN (JP)
TAKAMATSU NOBUHIRO (JP)
AIHARA SHIN (JP)
International Classes:
C09J7/10; C09J123/00; C09J179/08; H01L21/301; H01L21/52; H01L21/68; (IPC1-7): C09J7/02; C09J123/00; C09J179/08; H01L21/301; H01L21/52
Foreign References:
| JP2004349441A | 2004-12-09 | |||
| JP2002256239A | 2002-09-11 | |||
| JP2004059859A | 2004-02-26 |
Attorney, Agent or Firm:
Nakajima, Jun (NAKAJIMA & KATO Seventh Floor HK-Shinjuku
Bldg., 3-17, Shinjuku 4-chome, Shinjuku-k, Tokyo ., JP)
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