Title:
ADHESIVE FILM AND METHOD FOR MANUFACTURING ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2023/153512
Kind Code:
A1
Abstract:
An adhesive film 1 is provided with a release film 2, and an adhesive layer 3 laminated on one surface 2a side of the release film 2. The adhesive layer 3 comprises a body portion 3A, and a strip-shaped micro piece 3B protruding from the body portion 3A in an in-plane direction of the release film 2. On the other surface 2b side of the release film 2, a support film 5 is laminated in a region overlapping with at least a part of the micro piece 3B.
Inventors:
TATSUZAWA TAKASHI (JP)
MAEHARA YASUO (JP)
IZAWA HIROYUKI (JP)
ITOH YUKA (JP)
MAEHARA YASUO (JP)
IZAWA HIROYUKI (JP)
ITOH YUKA (JP)
Application Number:
PCT/JP2023/004804
Publication Date:
August 17, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J7/30; B32B27/00; C09J9/02; C09J11/00; C09J201/00; H01B1/22
Domestic Patent References:
| WO2018066411A1 | 2018-04-12 |
Foreign References:
| US20200160756A1 | 2020-05-21 | |||
| JP2019156912A | 2019-09-19 | |||
| JPS63185700A | 1988-08-01 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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