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Title:
ADHESIVE FILM AND METHOD FOR PRODUCING ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2022/265039
Kind Code:
A1
Abstract:
The present invention provides an adhesive film 10 having an adhesive layer 12 which is disposed on at least one surface of a heat-resistant layer 11. An essential component of the heat-resistant layer 11 is a thermoplastic resin having an aromatic ring in the monomer unit; the heat-resistant layer 11 has a deflection temperature under load of 100°C or higher; and the adhesive layer 12 contains a modified polyolefin resin as an essential component and further contains at least one resin having a styrene structure or a cyclic hydrocarbon structure.

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Inventors:
TAKEI KUNIHIRO (JP)
YOSHIKAWA YUIKO (JP)
Application Number:
PCT/JP2022/023949
Publication Date:
December 22, 2022
Filing Date:
June 15, 2022
Export Citation:
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Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
B32B27/00; B29C48/08; B29C48/154; B29C48/21; B29C48/395; B32B27/32; C08J5/18; C09J7/24; C09J7/30; C09J109/06; C09J123/26
Domestic Patent References:
WO2018135544A12018-07-26
WO2011129080A12011-10-20
Foreign References:
JP2017036351A2017-02-16
JP2009043601A2009-02-26
JP2020100720A2020-07-02
JP2011074230A2011-04-14
JP2016153448A2016-08-25
JP2014225378A2014-12-04
JP2021100064A2021-07-01
JP3839887B22006-11-01
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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