Title:
ADHESIVE FILM, MULTILAYER CIRCUIT SUBSTRATE, COMPONENT FOR SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/073583
Kind Code:
A1
Abstract:
Disclosed is an adhesive film characterized by containing: a thermosetting resin with a weight-average molecular weight of less than 1000; a film-forming resin; an oligomer compound having a weight-average molecular weight smaller than that of the film-forming resin and having a weight-average molecular weight larger than that of the thermosetting resin; and a flux activation compound.
Inventors:
FUJII TOMOE (JP)
MAEJIMA KENZOU (JP)
KATSURAYAMA SATORU (JP)
MAEJIMA KENZOU (JP)
KATSURAYAMA SATORU (JP)
Application Number:
PCT/JP2009/007055
Publication Date:
July 01, 2010
Filing Date:
December 21, 2009
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
FUJII TOMOE (JP)
MAEJIMA KENZOU (JP)
KATSURAYAMA SATORU (JP)
FUJII TOMOE (JP)
MAEJIMA KENZOU (JP)
KATSURAYAMA SATORU (JP)
International Classes:
C09J7/00; C09J133/00; C09J161/04; C09J163/00; C09J171/00; H01L21/60
Domestic Patent References:
| WO2008054012A1 | 2008-05-08 | |||
| WO2006043460A1 | 2006-04-27 |
Foreign References:
| JP2004273809A | 2004-09-30 | |||
| JP2003142529A | 2003-05-16 | |||
| JP2004188882A | 2004-07-08 |
Attorney, Agent or Firm:
HAYAMI, SHINJI (JP)
Shinji Hayami (JP)
Shinji Hayami (JP)
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