Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE FILM FOR SEMICONDUCTOR WAFER PROCESSING
Document Type and Number:
WIPO Patent Application WO/2018/003893
Kind Code:
A1
Abstract:
This adhesive film (100) for semiconductor wafer processing is sequentially provided with a base layer (10), an antistatic layer (30) and an adhesive resin layer (40) in this order, and is used for the purpose of protecting the surface of a semiconductor wafer or for the purpose of affixing a semiconductor wafer. The adhesive resin layer (40) contains an ion conductive additive.

Inventors:
KURIHARA HIROYOSHI (JP)
Application Number:
PCT/JP2017/023842
Publication Date:
January 04, 2018
Filing Date:
June 29, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI CHEMICALS TOHCELLO INC (JP)
International Classes:
B32B27/18; C09J4/00; C09J11/06; H01L21/304
Foreign References:
JP2009260332A2009-11-05
JP2006036834A2006-02-09
JPH0786212A1995-03-31
JP2003003132A2003-01-08
JP2008222781A2008-09-25
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: OIL CONTENT ANALYSIS DEVICE AND OIL CONTENT MEASUREMENT METHOD

Next Patent: LEANING VEHICLE