Title:
ADHESIVE FILM, TAPE FOR PROCESSING SEMICONDUCTOR WAFER, SEMICONDUCTOR PACKAGE, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/203527
Kind Code:
A1
Abstract:
Provided are: an adhesive film comprising an adhesive agent layer containing a thermosetting resin, a thermoplastic resin, and a heat conductive filler, wherein the heat conductive filler has a thermal conductivity of 12 W/m·K or more and is contained in an amount of 30-50 vol% in the adhesive agent layer, the thermoplastic resin contains at least one type of phenoxy resin, and the cured adhesive agent layer has a reliability coefficient S1 of 50-220 (× 10-6 GPa) as calculated according to mathematical formula (1), a reliability coefficient S2 of 10-120 (× 10-8 GPa) as calculated according to mathematical formula (2), and a thermal conductivity of 0.5 W/m·K or more; a tape for processing a semiconductor wafer; a semiconductor package; and a production method therefor. In mathematical formulas (1) and (2), S1, S2, Tg, CTEα1, a storage modulus E', and the saturated water absorption rate WA are of the adhesive agent layer after being cured. Tg represents a glass transition temperature, CTEα1 represents a linear expansion coefficient at the glass transition temperature or less, and the storage modulus E' is a value measured at 260ºC. In addition, units are given in brackets [].
Inventors:
KIRIKAE NORIYUKI (JP)
SANO TORU (JP)
MORITA MINORU (JP)
SANO TORU (JP)
MORITA MINORU (JP)
Application Number:
PCT/JP2018/017199
Publication Date:
November 08, 2018
Filing Date:
April 27, 2018
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C09J7/10; C09J7/35; C09J11/04; C09J11/06; C09J163/00; C09J171/10; C09J201/00; H01L21/52
Domestic Patent References:
| WO2010092804A1 | 2010-08-19 | |||
| WO2017158994A1 | 2017-09-21 |
Foreign References:
| JP2016155946A | 2016-09-01 | |||
| JP2012033638A | 2012-02-16 | |||
| JP2010205498A | 2010-09-16 | |||
| JP2015507677A | 2015-03-12 | |||
| JP2012207222A | 2012-10-25 | |||
| JP2011241245A | 2011-12-01 | |||
| JP2012131899A | 2012-07-12 |
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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