ADHESIVE FILM FOR USE IN HANDRAIL ON CONVEYOR

WIPO Patent Application WO/2007/058050

A1

Disclosed is an adhesive film for use in a handrail on a conveyor. The adhesive film has a first adhesive layer formed on one surface of a base film comprising a flexible resin, has a Young's modulus of 50 to 500 MPa, and shows no yield strength under an elongation percentage of 100% or less. For example, the adhesive film may have a 2%-modulus of 10 MPa or higher and also has a "stress 0 strain" under stretching by 15% of 5% or lower (the term "stress 0 strain" means a strain at which a film shows a stress value of 0 as determined after the film is stretched by 15% and then the stress at the time of the stretching is flipped in the direction opposite to the direction of the stretching). The base film may comprise an olefin resin and a rubbery polymer. The first adhesive layer may comprise at least polyisobutylene. The adhesive film may have an adhesive layer comprising a flexible adhesive resin formed on the other surface of the base film and an ink-receiving layer formed on the adhesive layer. The adhesive film has a high ability of tracking the shape of a handrail on a conveyor and can be detached easily.

JPH09217284	HEAT RESISTANT WATERPROOF SHEET
JP2015168163	GAS BARRIER LAMINATE
WO/2019/097819	SEMICONDUCTOR PROCESS SHEET AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

NAKANISHI HIDEO (JP)

PCT/JP2006/320941

May 24, 2007

October 20, 2006

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DAICEL CHEM (JP)
NAKANISHI HIDEO (JP)

B32B27/00; B41M5/00; B41M5/50; B41M5/52; B66B23/24; C09J7/02; C09J123/22

JP2004216856A	2004-08-05
JP2003276975A	2003-10-02
JPS57130883U	1982-08-14

KUWATA, Mitsuo (6th Floor Minato Umeda Building,, 3-17, Nishitemma 6-chome,, Kita-ku, Osaka-sh, Osaka47, JP)

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