Title:
ADHESIVE FOR FLOOR STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2014/065076
Kind Code:
A1
Abstract:
The present invention provides an adhesive for floor structure making it possible to provide a floor structure devoid of any incidence of squeak or gap formation, the floor structure capable of being easily peeled from a floor substrate when a floor finishing material is repaired. This adhesive for a floor structure contains a polyoxypropylene polymer (I) having a hydrolyzable silyl group, calcium carbonate, and a hollow filler. This adhesive for a floor structure can be used for adhesively integrating a floor finishing material (20) on a floor substrate (30) laid on a floor foundation (1).
Inventors:
MURAYAMA YUKIHIKO (JP)
Application Number:
PCT/JP2013/076125
Publication Date:
May 01, 2014
Filing Date:
September 26, 2013
Export Citation:
Assignee:
SEKISUI FULLER CO LTD (JP)
International Classes:
C09J183/04; C09J11/04; C09J11/06; C09J11/08; C09J183/12; E04F15/18
Domestic Patent References:
| WO2013047838A1 | 2013-04-04 |
Foreign References:
| JP2010111726A | 2010-05-20 | |||
| JP2009024096A | 2009-02-05 | |||
| JP2009024095A | 2009-02-05 | |||
| JP2005171217A | 2005-06-30 | |||
| JP2006143985A | 2006-06-08 | |||
| JPH05163477A | 1993-06-29 | |||
| JP2012057150A | 2012-03-22 | |||
| JP2006143984A | 2006-06-08 |
Attorney, Agent or Firm:
YAMAMOTO TAKUYA (JP)
Takuya Yamamoto (JP)
Takuya Yamamoto (JP)
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