Title:
ADHESIVE FORMULATION COMPRISING LIGNIN
Document Type and Number:
WIPO Patent Application WO/2019/202478
Kind Code:
A9
Abstract:
The present invention relates to an adhesive formulation comprising lignin, suitable for use in the manufacture of for example wood products.The lignin is provided in the form of a solution or dispersion or in dry solid form, such as in the form of a powder. The adhesive formulation also comprises phenol- formaldehyde (PF) resin and/or lignin-phenol-formaldehyde (LPF) resin. The adhesive formulation may also comprise extenders, hardeners, fillers and other additives, to achieve an adhesive formulation useful in the manufacture of for example wood products, such as plywood and laminated veneer lumber (LVL).The adhesive formulation can also be used in the manufacture of laminates and oriented strand boards.
Inventors:
NASLI BAKIR BEN (SE)
ZAFAR ASHAR (SE)
EKSTRÖM JESPER (SE)
ZAFAR ASHAR (SE)
EKSTRÖM JESPER (SE)
Application Number:
PCT/IB2019/053100
Publication Date:
December 19, 2019
Filing Date:
April 16, 2019
Export Citation:
Assignee:
STORA ENSO OYJ (FI)
International Classes:
C09J197/00; C08H8/00; C08L97/00; C09J161/00
Attorney, Agent or Firm:
STEINRUD, Henrik (SE)
Download PDF:
Previous Patent: PROCESS FOR PREPARING A BONDING RESIN
Next Patent: METHOD TO PERFORM DIAGNOSIS AND PROGNOSIS OF MELANOMA AND KIT
Next Patent: METHOD TO PERFORM DIAGNOSIS AND PROGNOSIS OF MELANOMA AND KIT