Title:
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND MANUFACTURING METHOD OF STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/201173
Kind Code:
A1
Abstract:
This adhesive for high-frequency dielectric heating contains a thermoplastic resin (A), the thermoplastic resin (A) contains a styrene-base copolymer resin (a1), the content of the styrene-base copolymer resin (a1) in the thermoplastic resin (A) is 40-100 vol%, the content of the styrene-base monomer units in the styrene-base copolymer resin (a1) is 10-90 mass%, the tensile modulus of the adhesive for high-frequency dielectric heating is greater than or equal to 20 MPa, and the dielectric property (tan δ / ε'r) of the adhesive for high-frequency dielectric heating is greater than or equal to 0.005. (tan δ is the dielectric tangent at 23°C and a frequency of 40.68 MHz, and ε'r is the relative permittivity at 23°C and a frequency of 40.68 MHz.)
Inventors:
TSUCHIBUCHI KOJI (JP)
TAYA NAOKI (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2021/014034
Publication Date:
October 07, 2021
Filing Date:
March 31, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B29C65/32; C09J5/06; C09J7/10; C09J7/30; C09J7/35; C09J11/04; C09J123/00; C09J125/08; H05B6/54
Domestic Patent References:
| WO2018079356A1 | 2018-05-03 |
Foreign References:
| JP2018053077A | 2018-04-05 | |||
| JP2018145295A | 2018-09-20 | |||
| JP2018527448A | 2018-09-20 | |||
| JP2010006908A | 2010-01-14 | |||
| JP2015183034A | 2015-10-22 | |||
| JP2017145425A | 2017-08-24 | |||
| JPH05340058A | 1993-12-21 | |||
| JP2009185138A | 2009-08-20 | |||
| JP2004148839A | 2004-05-27 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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