Title:
ADHESIVE FOR HIGH-FREQUENCY DIELECTRIC HEATING, STRUCTURE, AND METHOD FOR MANUFACTURING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/118826
Kind Code:
A1
Abstract:
Provided is an adhesive (11, 12) for high-frequency dielectric heating for joining at least three adherends (110, 120, 130). The adhesive (11, 12) for high-frequency dielectric heating contains a thermoplastic resin and a dielectric filler which generates heat upon application of a high-frequency electric field. The adhesive (11, 12) for high-frequency dielectric heating has an MVR of 1 cm3/10 min to 300 cm3/10 min inclusive at a lower limit temperature TL and an upper limit temperature TU or lower. The lower limit temperature TL (unit: °C) is defined by the following expression (11). The upper limit temperature TU (unit: °C) is defined by the following expression (12). (11): TL = Softening temperature TM of the adhesive for high-frequency dielectric heating + 10°C
(12): TU = Pyrolysis temperature TD of the adhesive for high-frequency dielectric heating - 10°C
Inventors:
TSUCHIBUCHI KOJI (JP)
TAYA NAOKI (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2021/043772
Publication Date:
June 09, 2022
Filing Date:
November 30, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; B32B7/027; B32B27/18; C09J5/06; C09J7/10; C09J7/30; C09J7/35; C09J11/04; C09J201/00; H05B6/54
Domestic Patent References:
| WO2020203206A1 | 2020-10-08 | |||
| WO2018079354A1 | 2018-05-03 | |||
| WO2021200686A1 | 2021-10-07 |
Foreign References:
| JP2010006908A | 2010-01-14 | |||
| JP2020070365A | 2020-05-07 | |||
| JP2018177825A | 2018-11-15 | |||
| JP2014213524A | 2014-11-17 | |||
| JP2003252658A | 2003-09-10 | |||
| JPH11187626A | 1999-07-09 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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