Title:
ADHESIVE KIT, AND ADHESIVE FILM AND ENCAPSULATION MATERIAL WHICH COMPRISE SAME, AND METHOD FOR ENCAPSULATING ORGANIC ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/112175
Kind Code:
A1
Abstract:
The present invention relates to an adhesive kit, and an adhesive film and an encapsulation material which comprise the same, and a method for encapsulating an organic electronic device.
Inventors:
LEE CHUNG GU (KR)
LEE KYUNG HWAN (KR)
KWON HYUK BONG (KR)
LEE KYUNG HWAN (KR)
KWON HYUK BONG (KR)
Application Number:
PCT/KR2018/012867
Publication Date:
June 13, 2019
Filing Date:
October 26, 2018
Export Citation:
Assignee:
KCC CORP (KR)
International Classes:
C09J123/22; C09J7/20; C09J11/04; C09J123/16; H01L51/52
Foreign References:
| KR101561103B1 | 2015-10-19 | |||
| KR20150016880A | 2015-02-13 | |||
| JP2000260918A | 2000-09-22 | |||
| KR20160124104A | 2016-10-26 | |||
| KR20140018816A | 2014-02-13 |
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
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