Title:
ADHESIVE, LAMINATE, AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/172761
Kind Code:
A1
Abstract:
Provided are: a solvent-free adhesive which has excellent resistance to the contents and is less apt to redissolve print layers; and a laminate and a packaging material both obtained using the adhesive. The solvent-free adhesive comprises a polyol composition (X) and a polyisocyanate composition (Y), wherein the polyol composition (X) has a number-average molecular weight of 450-1000 and comprises a polyol (A) which is a tetra- or higher-functional sugar alcohol derivative and a polyester polyol (B) which is a reaction product obtained from a composition comprising a polyhydric alcohol and a polycarboxylic acid, the proportion of the polyol (A) in the sum of the polyol (A) and the polyester polyol (B) being 5-30 mass%.
Inventors:
AKITA KOUJI (JP)
KIMURA RYOUJI (JP)
FUKUOKA HIROTAKE (JP)
TOMITA DAIKI (JP)
TAKEDA MIHO (JP)
KUROI TAKESHI (JP)
KARIMATA TOSHIHIRO (JP)
KIMURA RYOUJI (JP)
FUKUOKA HIROTAKE (JP)
TOMITA DAIKI (JP)
TAKEDA MIHO (JP)
KUROI TAKESHI (JP)
KARIMATA TOSHIHIRO (JP)
Application Number:
PCT/JP2022/002993
Publication Date:
August 18, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C09J175/06; B32B7/12; B32B27/00; B32B27/36; B32B27/40; B65D65/40; C09J7/30; C09J11/06; C09J11/08; C09J175/08
Domestic Patent References:
| WO2006043386A1 | 2006-04-27 |
Foreign References:
| US20200239752A1 | 2020-07-30 | |||
| JP2021025054A | 2021-02-22 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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