Title:
ADHESIVE LAYER-EQUIPPED LAMINATE, AND FLEXIBLE COPPER-CLAD LAMINATE SHEET AND FLEXIBLE FLAT CABLE USING SAME
Document Type and Number:
WIPO Patent Application WO/2016/017473
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an adhesive layer-equipped laminate that has excellent electrical characteristics, high adhesion with respect to a copper foil and a substrate film comprising a polyimide resin or the like, little warpage of the laminate when an adhesive layer is in a B-stage state, and good laminate storage stability. This adhesive layer-equipped laminate is provided with a substrate film and an adhesive layer on at least one of the surfaces of the substrate film. The adhesive layer-equipped laminate is characterized in that: the adhesive layer comprises an adhesive composition that contains a carboxyl group-containing styrene elastomer (A) and an epoxy resin (B); the content of the carboxyl group-containing styrene elastomer (A) is 50 parts by weight or more with respect to 100 parts by weight of the solid content of the adhesive composition; the content of the epoxy resin (B) is 1-20 parts by weight with respect to 100 parts by weight of the carboxyl group-containing styrene elastomer (A); and the adhesive layer is in a B-stage state.
Inventors:
OKIMURA YUYA (JP)
YAMADA MASASHI (JP)
YAMADA MASASHI (JP)
Application Number:
PCT/JP2015/070694
Publication Date:
February 04, 2016
Filing Date:
July 21, 2015
Export Citation:
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
B32B15/08; B32B25/08; B32B27/00; C09J7/35; C09J125/08; C09J153/02; C09J163/00; H05K1/02; H05K3/28
Domestic Patent References:
| WO2006090715A1 | 2006-08-31 | |||
| WO2012011265A1 | 2012-01-26 |
Foreign References:
| JP2002088332A | 2002-03-27 |
Download PDF: