ADHESIVE MATERIAL, PRESSURE SENSITIVE ADHESIVE FILM AND METHOD OF USE THEREOF

Title:

ADHESIVE MATERIAL, PRESSURE SENSITIVE ADHESIVE FILM AND METHOD OF USE THEREOF

Document Type and Number:

WIPO Patent Application WO/2005/090505

Kind Code:

A1

Abstract:

An adhesive material and pressure sensitive adhesive film containing the same, characterized in that they satisfy the following requirements (a) and (b). These adhesive material and pressure sensitive adhesive film exhibit excellent stability against not only light and heat but also various chemicals. Consequently, they find suitable application in surface protection uses, transport storage uses, heat treatment uses, grinding polish uses and cutting working uses in the fields of electronic/semiconductor materials, optical/display materials, etc. wherein demands for performance and quality are strict. The above requirements are: (a) an olefinic polymer is contained, and (b) in the measurement according to differential scanning calorimetry test, the melting temperature (Tm) is in the range of 80 to 180°C while the melting heat (&Dgr H) is at least 1 J/g.

Inventors:

AIHARA SHIN (JP)
OZAKI KATSUTOSHI (JP)
MORI RYOJI (JP)
SARUWATARI MASUMI (JP)
YOKOYAMA TAKASHI (JP)

Application Number:

PCT/JP2005/004960

Publication Date:

September 29, 2005

Filing Date:

March 18, 2005

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUI CHEMICALS INC (JP)
AIHARA SHIN (JP)
OZAKI KATSUTOSHI (JP)
MORI RYOJI (JP)
SARUWATARI MASUMI (JP)
YOKOYAMA TAKASHI (JP)

International Classes:

C09J7/02; C09J123/00; C09J123/14; (IPC1-7): C09J7/02; C09J123/00; C09J123/14

Foreign References:

JP2841509B2	1998-12-24
JP2000191853A	2000-07-11
JP2002519497A	2002-07-02
JP2002155249A	2002-05-28
JP2003147135A	2003-05-21
JP2003183463A	2003-07-03
JPH11100413A	1999-04-13
JP2003511541A	2003-03-25
JP2004307838A	2004-11-04

Other References: