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Title:
ADHESIVE MATERIAL, PRESSURE-SENSITIVE ADHESIVE SHEET, AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2010/013653
Kind Code:
A1
Abstract:
Disclosed is an adhesive material that has low viscosity, has good coatability, can be rendered solventless, has low adhesive strength while causing little increase in adhesive strength with the elapse of time, has good adhesion to an adherend, has excellent removability, and has a good wetting capability. The adhesive material has a peel adhesion of not more than 8 N/25 mm and is produced by curing a curable composition comprising a silyl group-containing polymer (S) represented by formula (1).  In formula (1), R1 represents a residue having a valency of t derived from a (mono)polyol; Q represents a divalent group formed by a reaction of a terminal group of a hydroxyl group, an amino group, an isocyanate group, an allyl group, an acryloyl group, or a methacryloyl group with a specific silyl compound; R3 represents a monovalent organic group; X represents a hydroxyl group or a hydrolyzable group; Y represents an ester bond-containing divalent group or an ether bond-containing divalent group; a is an integer of 1 to 3; r is an integer of 1 to 1000; and t is an integer of 1 to 8.

Inventors:
YASUDA TERUHIKO (JP)
SHIMOMA HITOSHI (JP)
SATO HISASHI (JP)
Application Number:
PCT/JP2009/063272
Publication Date:
February 04, 2010
Filing Date:
July 24, 2009
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
YASUDA TERUHIKO (JP)
SHIMOMA HITOSHI (JP)
SATO HISASHI (JP)
International Classes:
C09J201/10; C09J7/38; C09J167/00; C09J171/00; G02B5/02
Domestic Patent References:
WO2005073334A12005-08-11
WO2005073333A12005-08-11
WO2008123552A12008-10-16
WO2005073333A12005-08-11
WO2005073334A12005-08-11
Foreign References:
JPS55137129A1980-10-25
JP2004059870A2004-02-26
JP2002265928A2002-09-18
JPH11172232A1999-06-29
JPS60215058A1985-10-28
JP2001220568A2001-08-14
JP2005082777A2005-03-31
JP2003012751A2003-01-15
JP2003012751A2003-01-15
JPH11302371A1999-11-02
JP2008193830A2008-08-21
JP2008258750A2008-10-23
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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