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Title:
ADHESIVE MATERIAL AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2020/050629
Kind Code:
A1
Abstract:
The present invention relates to: a microneedle adhesive enabling a microneedle to be directly formed on an adhesive layer on a substrate and having both excellent adhesive strength and microneedle moldability; and a microneedle patch using same.

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Inventors:
LEE SANGKUG (KR)
SONG HOJUN (KR)
KANG JUHUI (KR)
SEOK WOONGCHEOL (KR)
Application Number:
PCT/KR2019/011414
Publication Date:
March 12, 2020
Filing Date:
September 04, 2019
Export Citation:
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Assignee:
KOREA INST IND TECH (KR)
International Classes:
C09J133/08; A61M37/00
Foreign References:
JP2010540507A2010-12-24
JP2011126864A2011-06-30
KR20120023711A2012-03-13
JP2017530967A2017-10-19
KR20010072666A2001-07-31
KR101964264B12019-04-01
Attorney, Agent or Firm:
NA, Seungtaek (KR)
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