ADHESIVE MEMBER, ADHESION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE CASING

Title:

ADHESIVE MEMBER, ADHESION METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE CASING

Document Type and Number:

WIPO Patent Application WO/2021/095224

Kind Code:

A1

Abstract:

An adhesive member provided with: a first pin section that is inserted into a first hole formed in a first adhered member; a second pin section that is inserted into a second hole formed in a second adhered member adhered to the first adhered member, and that is formed coaxially with the first pin section; and a flange part that is formed using an adhesive and is attached to the side surface of the first pin section or the side surface of the second pin section in the manner of a flange.

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Inventors:

YOKOMURA NOBUO (JP)
KAMIYAMA KOJI (JP)
WATAI ATSUKI (JP)
NAGATA KENTARO (JP)

Application Number:

PCT/JP2019/044824

Publication Date:

May 20, 2021

Filing Date:

November 15, 2019

Export Citation:

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Assignee:

MITSUBISHI ELECTRIC CORP (JP)

International Classes:

F16B11/00; F16B5/00; F16B13/14

Foreign References:

US20180313391A1	2018-11-01
US20140079507A1	2014-03-20
JPH07279918A	1995-10-27
JP3041679U	1997-09-22

Attorney, Agent or Firm:

SOGA, Michiharu et al. (JP)

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