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Title:
ADHESIVE FOR MOLDED POLYBENZIMIDAZOLE RESIN AND UNITED POLYBENZIMIDAZOLE MOLDING PRODUCED WITH THE SAME
Document Type and Number:
WIPO Patent Application WO/2001/048113
Kind Code:
A1
Abstract:
An adhesive for united polybenzimidazole resin moldings and a process for producing a united molding with the adhesive in a high yield. The adhesive comprises a polybenzimidazole resin, an epoxy resin, a polyamide resin, a polyimide resin, a polyamide-imide resin, and other resin(s). This adhesive is applied to a part made of a polybenzimidazole resin and this part is press-bonded to another part to produce a united molding.

Inventors:
NIWA NORIYUKI (JP)
AIZAWA MASAMI (JP)
Application Number:
PCT/JP2000/009154
Publication Date:
July 05, 2001
Filing Date:
December 22, 2000
Export Citation:
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Assignee:
CLARIANT INT LTD (CH)
CLARIANT JAPAN K K (JP)
NIWA NORIYUKI (JP)
AIZAWA MASAMI (JP)
International Classes:
C08J5/12; C09J179/04; (IPC1-7): C09J201/00; C08J5/12; C09J5/00; C09J179/04
Foreign References:
JPH0869862A1996-03-12
JPH04323034A1992-11-12
US3775213A1973-11-27
US4321182A1982-03-23
US4113683A1978-09-12
JPS60181128A1985-09-14
JPH04348936A1992-12-03
JPH02145669A1990-06-05
JPS5074881A1975-06-19
EP0691389A11996-01-10
EP0676435A11995-10-11
EP0913444A21999-05-06
US3502756A1970-03-24
US3836500A1974-09-17
US3539523A1970-11-10
JPH08142262A1996-06-04
Attorney, Agent or Firm:
Sato, Kazuo (Fuji Bldg. 2-3 Marunouchi 3-chome Chiyoda-ku, Tokyo, JP)
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