Title:
ADHESIVE FOR NONELECTROLYTIC PLATING AND PROCESS FOR THE PREPARATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2004/096937
Kind Code:
A1
Abstract:
An adhesive for nonelectrolytic plating which can not only be prepared without dust explosion but also can give a resinous insulating layer excellent in layer insulation. This adhesive can be prepared by mixing a dispersion in an organic solvent of cured particles of a heat-resistant resin soluble in acids or oxidizing agents or decomposable therewith with an uncured resin, the dispersion being one prepared by dispersing cured particles obtained in preparing cured particles of a heat-resistant resin in an organic solvent without drying the particles, and the uncured resin being one having the property of being cured into a substance difficulty soluble in acids or oxidizing agents and thus giving a heat-resistant cured resin.
Inventors:
ONO YOSHITAKA (JP)
ADACHI TAKI (JP)
ADACHI TAKI (JP)
Application Number:
PCT/JP1998/004955
Publication Date:
November 11, 2004
Filing Date:
November 02, 1998
Export Citation:
Assignee:
ONO YOSHITAKA (JP)
ADACHI TAKI (JP)
ADACHI TAKI (JP)
International Classes:
C23C18/20; C09J171/12; C09J181/02; C09J181/06; C23C18/28; H05K3/18; H05K3/38; H05K3/46; (IPC1-7): C09J201/00; C08J3/09; C09J11/08; C09J161/04; C09J163/00; C09J179/04; H05K3/38; H05K3/46
Foreign References:
| JPH01301775A | 1989-12-05 | |||
| JPS61276875A | 1986-12-06 | |||
| JPH09208911A | 1997-08-12 | |||
| JPH08239640A | 1996-09-17 | |||
| JPH0529761A | 1993-02-05 | |||
| JPH028283A | 1990-01-11 |
Attorney, Agent or Firm:
Ogawa, Junzo (8-9 Ginza 2-chom, Chuo-ku Tokyo, JP)
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