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Title:
ADHESIVE FOR OPTICAL IMAGE FORMATION DEVICE, CURED RESIN ARTICLE, OPTICAL ELEMENT, AND OPTICAL IMAGE FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/095904
Kind Code:
A1
Abstract:
This adhesive for an optical image formation device is for bonding two resin substrates of an optical image formation device in which two resin substrates each have a relief surface, each have a light-reflection section on a portion of the relief surface, and are bonded such that the relief surfaces face each other. The adhesive for an optical image formation device includes an alicyclic epoxy resin, an oxetane-ring-containing compound, an ether-group-containing epoxy resin, a tackifier resin, and a photopolymerization initiator.

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Inventors:
NAGATA KEI (JP)
Application Number:
PCT/JP2023/038821
Publication Date:
May 10, 2024
Filing Date:
October 27, 2023
Export Citation:
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Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C09J163/00; C09J11/06; G02B1/04; G02B30/56
Foreign References:
JP2019178208A2019-10-17
JP2014502369A2014-01-30
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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