Title:
ADHESIVE RESIN COMPOSITION AND HOT-MELT ADHESIVE OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2012/099107
Kind Code:
A1
Abstract:
[Problem] To provide an adhesive resin composition having improved heat resistance without losing adhesive strength or flexibility. [Solution] The adhesive resin composition comprises 30-98 wt% of an ethylene-vinyl acetate copolymer (a) and 70-2 wt% of the belowmentioned propylene-based resin composition (P) (the total of component (a) and component (P) is 100 wt%). The propylene-based resin composition (P) comprises 60-0 wt% of a propylene polymer (b) having a melting point of 120-170°C and a melt flow rate of 0.1-500 g/10 minutes, and 40-100 wt% of a propylene polymer (c) having a melting point that is less than 120°C or a melting point that is not observed and a melt flow rate of 0.1-500 g/10 minutes (the total of component (b) and component (c) is 100 wt%).
Inventors:
YASUI HIROTO (JP)
MATSUNAGA KOJI (JP)
MATSUNAGA KOJI (JP)
Application Number:
PCT/JP2012/050822
Publication Date:
July 26, 2012
Filing Date:
January 17, 2012
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
YASUI HIROTO (JP)
MATSUNAGA KOJI (JP)
YASUI HIROTO (JP)
MATSUNAGA KOJI (JP)
International Classes:
C09J123/08; C09J11/06; C09J11/08; C09J123/10; C09J123/14; C09J123/26; C09J131/04
Domestic Patent References:
| WO2004087775A1 | 2004-10-14 | |||
| WO2006098452A1 | 2006-09-21 |
Foreign References:
| JPH1135911A | 1999-02-09 | |||
| JPH10130607A | 1998-05-19 | |||
| JPH08325539A | 1996-12-10 | |||
| JPH08134428A | 1996-05-28 | |||
| JPH083527A | 1996-01-09 | |||
| JPS5847038A | 1983-03-18 | |||
| JP2003183611A | 2003-07-03 | |||
| JP2005272744A | 2005-10-06 | |||
| JP2001511866A | 2001-08-14 | |||
| JPH08325539A | 1996-12-10 | |||
| JPH083527A | 1996-01-09 | |||
| JP2007186664A | 2007-07-26 | |||
| JPH07145212A | 1995-06-06 | |||
| JP2003518171A | 2003-06-03 | |||
| JPH03163088A | 1991-07-15 |
Other References:
G. J. RAY, MACROMOLECULES, vol. 10, 1977, pages 773
J. C. RANDALL, MACROMOLECULES, vol. 15, 1982, pages 353
J. POLYMER SCIENCE, POLYMER PHYSICS ED., vol. 11, 1973, pages 275
K. KIMURA, POLYMER, vol. 25, 1984, pages 441
JOURNAL OF ORGANOMETALLIC CHEMISTRY, vol. 369, 1989, pages 359 - 370
See also references of EP 2666837A4
J. C. RANDALL, MACROMOLECULES, vol. 15, 1982, pages 353
J. POLYMER SCIENCE, POLYMER PHYSICS ED., vol. 11, 1973, pages 275
K. KIMURA, POLYMER, vol. 25, 1984, pages 441
JOURNAL OF ORGANOMETALLIC CHEMISTRY, vol. 369, 1989, pages 359 - 370
See also references of EP 2666837A4
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
Patent business corporation SSINPAT (JP)
Patent business corporation SSINPAT (JP)
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Claims: