Title:
ADHESIVE RESIN COMPOSITION, ADHESIVE RESIN MOLDED ARTICLE, ADHESIVE RESIN LAMINATE, AND HOUSING SEALING MEMBER
Document Type and Number:
WIPO Patent Application WO/2021/181315
Kind Code:
A1
Abstract:
The present invention provides an adhesive resin composition that exhibits both adhesive properties and gas barrier properties, an adhesive resin molded article, an adhesive resin laminate, and a housing sealing member. More specifically, the present invention provides an adhesive resin composition that contains, as essential components, an acid-modified polyolefin resin (A) and an inorganic filler (B) that serves as a gas barrier component, said adhesive resin composition containing 50-90 parts by weight of the acid-modified polyolefin resin (A) and 10-30 parts by weight of the inorganic filler per 100 parts by weight of all of the solid components.
Inventors:
TAKEI KUNIHIRO (JP)
MARUYAMA YUIKO (JP)
TAKEYAMA SHUNSUKE (JP)
MARUYAMA YUIKO (JP)
TAKEYAMA SHUNSUKE (JP)
Application Number:
PCT/IB2021/052012
Publication Date:
September 16, 2021
Filing Date:
March 11, 2021
Export Citation:
Assignee:
FUJIMORI KOGYO CO (JP)
International Classes:
C09J11/04; C09J7/35; C09J123/26
Domestic Patent References:
| WO2016199754A1 | 2016-12-15 | |||
| WO2013015259A1 | 2013-01-31 |
Foreign References:
| JP2014004778A | 2014-01-16 |
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