ADHESIVE RESIN AND FILM ADHESIVES MADE BY USING THE SAME

Title:

ADHESIVE RESIN AND FILM ADHESIVES MADE BY USING THE SAME

Document Type and Number:

WIPO Patent Application WO/2003/102049

Kind Code:

A1

Abstract:

The adhesive resin of the invention consists of a polyimide resin obtained by reacting a diamine component containing the compound (1) as the essential component with a tetracarboxylic acid dianhydride component. (1) The diamine component contains a silicone diamine having a specific structure and/or the tetracarboxylic acid dianhydride component contains a silicone acid dianhydride having a specific structure. Film adhesives made by using the adhesive resin preferably together with a thermosetting resin, and, if necessary, an inorganic filler are excellent in low-temperature adhesion, resistance to moisture absorption, heat resistance, and workability in adhesive bonding and are favorably usable as semiconductor-mounting materials for bonding semiconductor devices to substrates.

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Inventors:

KINOSHITA JIN (JP)
MORITA MORITSUGU (JP)
MORI MINEHIRO (JP)
KODAMA YOICHI (JP)

Application Number:

PCT/JP2003/006776

Publication Date:

December 11, 2003

Filing Date:

May 29, 2003

Export Citation:

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Assignee:

MITSUI CHEMICALS INC (JP)
KINOSHITA JIN (JP)
MORITA MORITSUGU (JP)
MORI MINEHIRO (JP)
KODAMA YOICHI (JP)

International Classes:

C08G73/10; C09J7/10; C09J179/08; H01L21/58; C08L63/00; (IPC1-7): C08G73/10; C09J179/08; C09J7/00; H01L21/52

Foreign References:

JPH08127656A	1996-05-21
JPH08134213A	1996-05-28
JPH08259924A	1996-10-08

Other References: