Title:
ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AMD METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/200585
Kind Code:
A1
Abstract:
Provided is an adhesive for a semiconductor, the adhesive being used to seal connection portions in a semiconductor device having: a connection structure in which connection portions of semiconductor chips and a wiring circuit board are electrically connected to each other; and/or a connection structure in which connection portions of a plurality of semiconductor chips are electrically connected to each other. The adhesive for a semiconductor contains a curable resin component, a flux agent, and an inorganic filler, wherein the content of the inorganic filler is 60-95 mass% with respect to the total amount of said adhesive, and the thermal conductivity of said adhesive after curing is at least 1.5 W/mK.
Inventors:
OKUBO TAKENORI (JP)
KURODA TAKAHIRO (JP)
KURODA TAKAHIRO (JP)
Application Number:
PCT/JP2021/012677
Publication Date:
October 07, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J9/00; C09J11/04; C09J11/06; C09J201/00; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| WO2017145624A1 | 2017-08-31 |
Foreign References:
| JP2016204645A | 2016-12-08 | |||
| JP2014208818A | 2014-11-06 | |||
| JP2015183093A | 2015-10-22 | |||
| JPS5635494A | 1981-04-08 | |||
| JP2013071991A | 2013-04-22 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF:
Previous Patent: QUANTUM CASCADE LASER ELEMENT AND QUANTUM CASCADE LASER DEVICE
Next Patent: DYNAMIC STATE OBSERVATION SYSTEM
Next Patent: DYNAMIC STATE OBSERVATION SYSTEM