Title:
ADHESIVE FOR SEMICONDUCTORS, AND SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2022/059095
Kind Code:
A1
Abstract:
An adhesive for semiconductors, said adhesive containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound that has an acid group, wherein: the heat quantity from 60°C to 155°C of the DSC curve is 20 J/g or less as determined by differential scanning calorimetry wherein the adhesive for semiconductors is heated at a heating rate of 10°C/minute; and the lowest melt viscosity of the viscosity curve is 2,000 Pa·s or more as determined by shear viscosity measurement wherein the adhesive for semiconductors is heated at a heating rate of 10°C/minute.
Inventors:
AKIYOSHI TOSHIYASU (JP)
UENO KEIKO (JP)
UENO KEIKO (JP)
Application Number:
PCT/JP2020/035093
Publication Date:
March 24, 2022
Filing Date:
September 16, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J163/00; C09J201/00; H01L21/60
Domestic Patent References:
| WO2018235854A1 | 2018-12-27 |
Foreign References:
| JP2015153942A | 2015-08-24 | |||
| JP2018141106A | 2018-09-13 | |||
| JP2019019248A | 2019-02-07 | |||
| JP2018145346A | 2018-09-20 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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