Title:
ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/107210
Kind Code:
A1
Abstract:
Disclosed is an adhesive set. The adhesive set comprises: a main agent containing a decomplexing agent; and an initiator containing an organic borane complex. At least one among the main agent and the initiator further contains a compound having a radically polymerizable group. At least one among the main agent and the initiator further contains a compound having a thiocarbonylthio structure.
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Inventors:
TANAKA TORU (JP)
KAWAMORI TAKASHI (JP)
MATSUNAGA MASAHIRO (JP)
FUJIYASU YOSUKE (JP)
KAWAMORI TAKASHI (JP)
MATSUNAGA MASAHIRO (JP)
FUJIYASU YOSUKE (JP)
Application Number:
PCT/JP2020/042819
Publication Date:
May 27, 2022
Filing Date:
November 17, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C09J4/00; C09J11/04
Domestic Patent References:
| WO2010147011A1 | 2010-12-23 |
Foreign References:
| JP2018530645A | 2018-10-18 | |||
| JP2005514489A | 2005-05-19 | |||
| JP2017141438A | 2017-08-17 | |||
| JP2005514489A | 2005-05-19 |
Other References:
See also references of EP 4141078A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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