Title:
ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/219115
Kind Code:
A1
Abstract:
Disclosed is an adhesive set. The adhesive set comprises: a main agent containing a decomplexing agent; and an initiator containing an organic borane complex. The decomplexing agent contains a maleic anhydride. At least one agent among the main agent and the initiator further contains a compound having a radically polymerizable group. At least one agent among the main agent and the initiator further contains one or more types of compound selected from the group consisting of a halogenated metal salt and a compound having a thiocarbonyl thio structure.
Inventors:
TANAKA TORU (JP)
KAWAMORI TAKASHI (JP)
MATSUNAGA MASAHIRO (JP)
KAWAMORI TAKASHI (JP)
MATSUNAGA MASAHIRO (JP)
Application Number:
PCT/JP2023/017623
Publication Date:
November 16, 2023
Filing Date:
May 10, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C09J4/00; B32B27/00; C09J11/04; C09J11/06
Domestic Patent References:
| WO2021033628A1 | 2021-02-25 | |||
| WO2022107210A1 | 2022-05-27 | |||
| WO2022107729A1 | 2022-05-27 |
Foreign References:
| JP2005514478A | 2005-05-19 | |||
| JP2018100345A | 2018-06-28 | |||
| JP2000500172A | 2000-01-11 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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