Title:
ADHESIVE SHEET BONDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2008/032550
Kind Code:
A1
Abstract:
An adhesive sheet bonding device for boding a sheet (S) to a card body (B) in an aligned manner.
The sheet bonding device has a non-adhesive guide sheet (23) for guiding the
peeled off sheet (S) to a bonding position (P) without the sheet (S) coming in contact
with the base board (B); a stopper (24) with which the forward ends of the base board
(B) and the sheet (S) are in contact at the bonding position (P), the stopper (24)
being movable between a position on a conveyance route and a position off the conveyance
route; a pressing roller (27) for pressing the forward end of the sheet (S) to the
forward end of the base board (B) to bond them together; and a sending roller (28)
placed facing the pressing roller (27) and sending the bonded sheet (S) and base
board (B) out of the bonding position (P). A cutout extending in the conveyance
direction is provided in the forward end of the guide sheet (23). The pressing
roller (27) presses, at the cutout, the forward end of the sheet (S) to the forward
end of the base board (B) to bond the sheet (S) and the base board (B) together.
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Inventors:
IHARA ATSUMI (JP)
Application Number:
PCT/JP2007/066520
Publication Date:
March 20, 2008
Filing Date:
August 27, 2007
Export Citation:
Assignee:
AI & DI CO LTD (JP)
IHARA ATSUMI (JP)
IHARA ATSUMI (JP)
International Classes:
B65C9/32; B42D15/10; B65C9/18; B65H37/04
Foreign References:
JPH11171152A | 1999-06-29 | |||
JPS5159300A | 1976-05-24 | |||
JPH05317040A | 1993-12-03 | |||
JP2001278233A | 2001-10-10 |
Other References:
See also references of EP 2067703A4
Attorney, Agent or Firm:
WATANABE, Atsushi (1-20-10-203 Takadanobab, Shinjuku-ku Tokyo 75, JP)
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