ADHESIVE SHEET AND METHOD FOR GRINDING BACK SURFACE OF SEMICONDUCTOR WAFER

WIPO Patent Application WO/2010/140569

A1

Adhesives in conventional adhesive sheets are increased in adhesion to semiconductor wafers after being bonded to the semiconductor wafers due to wetting and spreading over time. As a result, the semiconductor wafers are sometimes broken when the adhesive sheets are removed therefrom after grinding. This problem is likely to occur when the semiconductor wafers are thin. Disclosed is an adhesive sheet comprising a base and an adhesive layer that is provided on the base. The base is formed from an ethylene-vinyl acetate copolymer that has a vinyl acetate content of not more than 10% by mass. The adhesive layer contains 100 parts by mass of a (meth)acrylate copolymer, 1-10 parts by mass of a crosslinking agent and 0.05-5 parts by mass of a silicone compound. The (meth)acrylate copolymer is composed of a copolymer that is obtained by polymerizing a (meth)acrylate monomer and a functional group-containing monomer.

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KUME MASASHI (JP)
TAKATSU TOMOMICHI (JP)

PCT/JP2010/059210

December 09, 2010

May 31, 2010

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DENKI KAGAKU KOGYO KK (JP)
KUME MASASHI (JP)
TAKATSU TOMOMICHI (JP)

C09J7/38; C09J7/22; C09J11/08; C09J133/04; C09J183/04; H01L21/304

JP2000212520A	2000-08-02
JPH04117475A	1992-04-17
JPH07331210A	1995-12-19
JP2000008010A	2000-01-11
JP2005033000A	2005-02-03
JP2004006746A	2004-01-08
JP2000038556A	2000-02-08

SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
SK patent business corporation (JP)

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