Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT USING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2014/129469
Kind Code:
A1
Abstract:
Provided is an adhesive sheet having a substrate film and an adhesive layer on one side of the substrate film, in which the substrate film is a propylene-based copolymer and the substrate film has a melting peak, as measured by differential scanning calorimetry (DSC) in compliance with JIS K 7121, of at least 120°C and less than 140°C, a weight-average molecular weight (Mw) of 200,000-500,000, and a dispersion (Mw/Mn), which is the ratio of the weight-average molecular weight (Mw) to the number-average molecular weight (Mn), of at least 1.5 and less than 3.0.

More Like This:
WO/2015/162546ULTRAVIOLET CURABLE TRANSFER COATING FOR APPLYING NANOMETER SIZED METAL PARTICLES TO POLYMER SURFACE
JP2015074688TAPE FOR FORMING DOUBLE EYELID
Inventors:
SAITO TAKESHI (JP)
TSUKUI TOMOYA (JP)
Application Number:
PCT/JP2014/053801
Publication Date:
August 28, 2014
Filing Date:
February 18, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DENKI KAGAKU KOGYO KK (JP)
International Classes:
C09J7/02; H01L21/301
Domestic Patent References:
WO2012157615A12012-11-22
Foreign References:
JP2011126118A2011-06-30
JP2013089926A2013-05-13
JP2005088498A2005-04-07
Attorney, Agent or Firm:
EBISU International Patent Office (JP)
Patent business corporation エビス international patent firm (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MESH PANEL, FENCE, AND WIRE MATERIAL

Next Patent: ENERGY MANAGEMENT ASSIST DEVICE AND ENERGY MANAGEMENT ASSIST PROGRAM