Title:
ADHESIVE SHEET AND METHOD FOR PRODUCING LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2018/181517
Kind Code:
A1
Abstract:
The present invention pertains to: an adhesive sheet obtained by directly laminating a resin layer including a resin (S), a molecular adhesive layer, and a protective film in the stated order, said molecular adhesive layer having at least one reactive group (Zα) selected from the group consisting of amino groups, azide groups, mercapto groups, isocyanate groups, ureido groups, and epoxy groups, and at least one reactive group (Zβ) selected from the group consisting of silanol groups and groups that generate a silanol group due to a hydrolysis reaction, wherein the resin (S) has a reactive substructure (Zγ) that can form a chemical bond with the reactive group (Zα) of the molecular adhesive layer, and the Young's modulus at 23℃ of the protective film is at least 1 × 107; and a method for producing a laminated body in which the adhesive sheet is used. The present invention provides: an adhesive sheet having a resin layer, a molecular adhesive layer, and a protective film, said adhesive sheet having exceptional adhesiveness to an adherend; and a method for producing a laminated body in which the adhesive sheet is used.
Inventors:
NAKAYAMA HIDEKAZU (JP)
UEMURA KAZUE (JP)
UEMURA KAZUE (JP)
Application Number:
PCT/JP2018/012847
Publication Date:
October 04, 2018
Filing Date:
March 28, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/40; B32B27/00; C09J7/22; C09J7/30; C09J183/08; C09J201/00
Domestic Patent References:
| WO2013157567A1 | 2013-10-24 |
Foreign References:
| JP2008248236A | 2008-10-16 | |||
| JP2016117243A | 2016-06-30 |
Attorney, Agent or Firm:
OHISHI Haruhito (JP)
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