ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Title:

ADHESIVE SHEET AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2022/054889

Kind Code:

A1

Abstract:

An adhesive sheet having a laminated structure including an adhesive layer (X1) and a base material layer (Y), wherein the adhesive layer (X1) and/or the base material layer (Y) is a heat-expandable layer that contains heat-expandable particles, the arithmetic mean waviness (Wa) of the adhesive layer (X1) on a surface (SX1) on the opposite side of the surface facing the base material layer (Y) is 0.090 μm or less. A method for producing a semiconductor device using said adhesive sheet.

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Inventors:

KAKIUCHI YASUHIKO (JP)
WATANABE YASUTAKA (JP)

Application Number:

PCT/JP2021/033229

Publication Date:

March 17, 2022

Filing Date:

September 10, 2021

Export Citation:

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Assignee:

LINTEC CORP (JP)

International Classes:

B32B27/00; C09J5/06; C09J7/20; C09J7/38; C09J11/06; C09J11/08; C09J201/00

Domestic Patent References:

WO2019235217A1	2019-12-12
WO2019216262A1	2019-11-14

Foreign References:

JP2016108353A	2016-06-20
JP2015168711A	2015-09-28
JP2008045011A	2008-02-28
JP2012184276A	2012-09-27

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

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