Title:
ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, AND PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/196755
Kind Code:
A1
Abstract:
Provided is an adhesive sheet that exhibits an appropriate adhesive force when temporarily adhered and has excellent releasing performance during heat peeling, even if an adhesive layer is formed using an energy ray-polymerizable component. Also provided are a production method for the adhesive sheet and a production method for a semiconductor device using the adhesive sheet. The adhesive sheet has a base material (Y) and an adhesive layer (X1) that contains thermally expandable particles and a polymer of an energy ray-polymerizable component. The shear storage modulus G' (23) of the adhesive layer (X1) at 23°C is 1.0 × 104–5.0 × 107 Pa.
Inventors:
AKUTSU TAKASHI (JP)
Application Number:
PCT/JP2020/013671
Publication Date:
October 01, 2020
Filing Date:
March 26, 2020
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B27/00; C09J5/00; C09J7/38; C09J11/06; C09J201/00; H01L21/301; H01L21/304
Domestic Patent References:
| WO2013042698A1 | 2013-03-28 | |||
| WO2018181770A1 | 2018-10-04 | |||
| WO2018074316A1 | 2018-04-26 | |||
| WO2010122943A1 | 2010-10-28 | |||
| WO2016076131A1 | 2016-05-19 | |||
| WO2017150676A1 | 2017-09-08 |
Foreign References:
| JP2011074245A | 2011-04-14 | |||
| JP2013159743A | 2013-08-19 | |||
| JP2013203800A | 2013-10-07 | |||
| JP2007284666A | 2007-11-01 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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