Title:
ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PRODUCTION, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/050663
Kind Code:
A1
Abstract:
The objective of the present invention is to provide an adhesive sheet that is for semiconductor device production, can be firmly affixed to the pedestal of a semiconductor wafer, and is such that the pedestal is easily separated from the semiconductor wafer. The present invention pertains to the adhesive sheet for semiconductor device production and used for affixing a semiconductor wafer to a pedestal, wherein the adhesive sheet has a first adhesive layer and a second layer having a lower adhesive strength than the first adhesive layer, and at least the peripheral section of the adhesive sheet for semiconductor device production is formed from a first adhesive layer.
Inventors:
UENDA DAISUKE (JP)
ISHII JUN (JP)
ISHII JUN (JP)
Application Number:
PCT/JP2013/075174
Publication Date:
April 03, 2014
Filing Date:
September 18, 2013
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J5/06; C09J7/10; C09J9/02; C09J179/04; H01L21/304
Foreign References:
| JPH0562950A | 1993-03-12 | |||
| JP2004253612A | 2004-09-09 | |||
| JP2003243347A | 2003-08-29 | |||
| JP2010245191A | 2010-10-28 | |||
| JP2005268434A | 2005-09-29 | |||
| JP2011137057A | 2011-07-14 | |||
| JP2013211438A | 2013-10-10 | |||
| JP2013214720A | 2013-10-17 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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