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Title:
ADHESIVE SHEET, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/044543
Kind Code:
A1
Abstract:
The adhesive sheet according to the present invention is provided with different material sheets that are flush with each other.

Inventors:
YAMAGUCHI TAKESHI (JP)
NAKAO MAKI (JP)
Application Number:
PCT/JP2021/025063
Publication Date:
March 03, 2022
Filing Date:
July 02, 2021
Export Citation:
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Assignee:
NITTO SHINKO CORP (JP)
International Classes:
C09J11/04; C09J7/10; C09J7/35; C09J163/00; H01L23/36
Foreign References:
JP2014070182A2014-04-21
JP2014220348A2014-11-20
JP2015082652A2015-04-27
JPH08193188A1996-07-30
JP2008088406A2008-04-17
JP2020141744A2020-09-10
JP2013030649A2013-02-07
Attorney, Agent or Firm:
FUJIMOTO & PARTNERS (JP)
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