Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2017/038919
Kind Code:
A1
Abstract:
Disclosed is an adhesive sheet (10) that is used at the time of sealing a semiconductor element on the adhesive sheet, the adhesive sheet (10) comprising a substrate (11) and an adhesive agent layer (12) including an adhesive agent. After attaching the adhesive agent layer (12) of the adhesive sheet (10) to a polyimide film and performing heating at 190°C for 1 hour, the adhesive force with respect to the polyimide film in a 40°C atmosphere is 2.5 N/25 mm or less.
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Inventors:
TAKANO KEN (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
KIKUCHI KAZUHIRO (JP)
SUGINO TAKASHI (JP)
Application Number:
PCT/JP2016/075606
Publication Date:
March 09, 2017
Filing Date:
September 01, 2016
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/20; C09J133/08; C09J183/04; H01L21/56
Domestic Patent References:
| WO2012111540A1 | 2012-08-23 |
Foreign References:
| JP2011134811A | 2011-07-07 | |||
| JP2012062373A | 2012-03-29 | |||
| JP2012031316A | 2012-02-16 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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