Title:
ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2023/149023
Kind Code:
A1
Abstract:
Provided is an adhesive sheet that can be used in transfer of electronic components, said adhesive sheet being capable of contributing to a reduction in production costs, achieving excellent positional accuracy of electronic components and excellent fixability and peelability of electronic components with respect to the adhesive sheet, and being capable of preventing contamination of electronic components and damage to electronic components. The present invention provides an adhesive sheet including an adhesive layer composed of an active energy ray-curable adhesive, wherein: the active energy ray-curable adhesive contains an ultraviolet absorber and/or a photopolymerization initiator; the adhesive layer has an initial indentation modulus of 4 MPa or less at 23°C; the adhesive layer has an indentation modulus of 150 MPa or more at 23°C after being irradiated with ultraviolet rays of 460 mJ/cm2; and the adhesive sheet has a light transmittance of 50% or less at a wavelength of 355 nm.
Inventors:
CHIBA MIZUHO (JP)
TANAKA SHUMPEI (JP)
OCHI GENKI (JP)
TANAKA SHUMPEI (JP)
OCHI GENKI (JP)
Application Number:
PCT/JP2022/038941
Publication Date:
August 10, 2023
Filing Date:
October 19, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J11/06; C09J133/14; H01L33/48
Domestic Patent References:
| WO2021220662A1 | 2021-11-04 | |||
| WO2021131518A1 | 2021-07-01 | |||
| WO2022163005A1 | 2022-08-04 | |||
| WO2022118499A1 | 2022-06-09 |
Foreign References:
| JP2018012751A | 2018-01-25 | |||
| JP2012054432A | 2012-03-15 | |||
| JP2020053558A | 2020-04-02 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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