Title:
ADHESIVE, STACK, PACKAGING MATERIAL, BATTERY-USE PACKAGING MATERIAL, AND BATTERY
Document Type and Number:
WIPO Patent Application WO/2021/131722
Kind Code:
A1
Abstract:
Provided is an adhesive that is excellent in terms of ability to adhere to a variety of base materials, in particular, the ability to adhere a resin base material to a metal base material, and is excellent in various forms of resistance to solvents and resistance to electrolytic solutions. The adhesive is characterized by comprising a first agent and a second agent, wherein the first agent includes a resin (A) containing an acid group-containing olefin resin (A1), the second agent includes a compound (B) that is reactive with the acid group in the acid group-containing olefin resin (A1), and a crystallization peak is observed for the acid group-containing olefin resin (A1) in a DSC curve which has been plotted in a differential scanning calorimetry measurement, as measured on the cured product of a composition yielded by mixing the acid group-containing olefin resin (A1) and an epoxy compound that is liquid at 25°C in such a manner that the epoxy excess percentage reaches between 0.1 and 1.5 inclusive, according to the crystallization temperature measurement method described in JIS-K-7121.
Inventors:
YAMADA SHINJIRO (JP)
MIYAMAE YURIKA (JP)
MIKI SHOU (JP)
KANNO TSUTOMU (JP)
NAKAMURA HIDEMI (JP)
KOUYAMA TATSUYA (JP)
MINAKUCHI RYO (JP)
MIYAMAE YURIKA (JP)
MIKI SHOU (JP)
KANNO TSUTOMU (JP)
NAKAMURA HIDEMI (JP)
KOUYAMA TATSUYA (JP)
MINAKUCHI RYO (JP)
Application Number:
PCT/JP2020/045957
Publication Date:
July 01, 2021
Filing Date:
December 10, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/32; C09J11/06; C09J123/00; H01M50/10
Domestic Patent References:
WO2019069896A1 | 2019-04-11 | |||
WO2018066670A1 | 2018-04-12 | |||
WO2017038615A1 | 2017-03-09 |
Foreign References:
JP2019182976A | 2019-10-24 | |||
JP2014220172A | 2014-11-20 | |||
JP2014199761A | 2014-10-23 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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