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Title:
ADHESIVE, STACK, PACKAGING MATERIAL, BATTERY-USE PACKAGING MATERIAL, AND BATTERY
Document Type and Number:
WIPO Patent Application WO/2021/131722
Kind Code:
A1
Abstract:
Provided is an adhesive that is excellent in terms of ability to adhere to a variety of base materials, in particular, the ability to adhere a resin base material to a metal base material, and is excellent in various forms of resistance to solvents and resistance to electrolytic solutions. The adhesive is characterized by comprising a first agent and a second agent, wherein the first agent includes a resin (A) containing an acid group-containing olefin resin (A1), the second agent includes a compound (B) that is reactive with the acid group in the acid group-containing olefin resin (A1), and a crystallization peak is observed for the acid group-containing olefin resin (A1) in a DSC curve which has been plotted in a differential scanning calorimetry measurement, as measured on the cured product of a composition yielded by mixing the acid group-containing olefin resin (A1) and an epoxy compound that is liquid at 25°C in such a manner that the epoxy excess percentage reaches between 0.1 and 1.5 inclusive, according to the crystallization temperature measurement method described in JIS-K-7121.

Inventors:
YAMADA SHINJIRO (JP)
MIYAMAE YURIKA (JP)
MIKI SHOU (JP)
KANNO TSUTOMU (JP)
NAKAMURA HIDEMI (JP)
KOUYAMA TATSUYA (JP)
MINAKUCHI RYO (JP)
Application Number:
PCT/JP2020/045957
Publication Date:
July 01, 2021
Filing Date:
December 10, 2020
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/32; C09J11/06; C09J123/00; H01M50/10
Domestic Patent References:
WO2019069896A12019-04-11
WO2018066670A12018-04-12
WO2017038615A12017-03-09
Foreign References:
JP2019182976A2019-10-24
JP2014220172A2014-11-20
JP2014199761A2014-10-23
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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