Title:
ADHESIVE SUBSTRATE, ASSEMBLY, MULTILAYER ASSEMBLY, AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/045053
Kind Code:
A1
Abstract:
This adhesive substrate is used for forming a structure by adhering the adhesive substrate to an adherend. The adhesive substrate includes a substrate, and an entangled polymer layer that has a thickness of 1-20 nm and that is formed of a thermoplastic resin that is entangled with the surface of the substrate through adsorption or bonding. The thermoplastic resin includes a reactive thermoplastic resin having a reactive group including a radical reactive group or an addition reactive group. The reactive group is distributed on a surface of the entangled polymer layer to form a reaction active portion.
Inventors:
TANAKA KEIJI (JP)
KAWAGUCHI DAISUKE (JP)
TOTANI MASAYASU (JP)
KAWAGUCHI DAISUKE (JP)
TOTANI MASAYASU (JP)
Application Number:
PCT/JP2021/030768
Publication Date:
March 03, 2022
Filing Date:
August 23, 2021
Export Citation:
Assignee:
UNIV KYUSHU NAT UNIV CORP (JP)
International Classes:
C09J7/30; B32B7/12; C09J5/00; C09J201/02; C09J133/04; C09J163/04
Domestic Patent References:
| WO2018181517A1 | 2018-10-04 |
Foreign References:
| JP2016204461A | 2016-12-08 | |||
| JP2010204361A | 2010-09-16 | |||
| JPH02170884A | 1990-07-02 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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