ADHESIVE TAPE AND METHOD FOR DISASSEMBLING ELECTRONIC DEVICES AND ARTICLES

WIPO Patent Application WO/2016/002614

A1

The present invention addresses the problem of providing an adhesive tape that is provided with exceptional adhesive strength in a temperature range below 60°C (inclusive) and in which the adhesive strength is sharply reduced by applying heat for a short time. The present invention pertains to an adhesive tape containing a rubber-based adhesive layer and is characterized in that: the storage elastic modulus at 120°C, G120, of an adhesive component contained in the adhesive layer is 1.0 x 103 Pa to 2.0 x 105 Pa, and the ratio G23/G120, of the storage elastic modulus at 23°C, G23, to the storage elastic modulus G120, is from 1 to 20, inclusive.

WO/2006/058829	ADHESIVE STRIP THAT CAN BE ACTIVATED BY HEAT AND IS BASED ON NITRILE RUBBER AND POLYVINYL BUTYRAL FOR STICKING TOGETHER ELECTRONIC COMPONENTS AND STRIP CONDUCTORS
JP6775616	An adhesive layer for an optical film, an adhesive film for an optical film, and an adhesive composition for an optical film for producing them.
JP2015521214	Three-dimensional conductive adhesive film

AKIYAMA SEIJI (JP)
MORINO AKINORI (JP)

PCT/JP2015/068311

January 07, 2016

June 25, 2015

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DAINIPPON INK & CHEMICALS (JP)

C09J7/10; C09J109/06; C09J153/00

JP2004161886A	2004-06-10
JPH0543851A	1993-02-23
JP2004527396A	2004-09-09

KONO MICHIHIRO (JP)
Michihiro Kono (JP)

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