Title:
ADHESIVE TAPE, METHOD FOR IMMOBILIZING ELECTRONIC DEVICE COMPONENT OR ON-VEHICLE DEVICE COMPONENT, METHOD FOR MANUFACTURING ELECTRONIC DEVICE OR ON-VEHICLE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/202778
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide an adhesive tape capable of exerting excellent adhesive force on a rough surface. Another purpose of the present invention is to provide: a method for immobilizing an electronic device component or an on-vehicle device component by using said adhesive tape; and a method for manufacturing an electronic device or an on-vehicle device. The adhesive tape according to the present invention includes an adhesive agent layer containing an acrylic copolymer which includes 30 wt% or more of a structural unit derived from n-heptyl(meth)acrylate and 0.01-30 wt% of a structural unit derived from 1-methylheptyl(meth)acrylate.
Inventors:
ADACHI AYA (JP)
OGATA YUDAI (JP)
UCHIDA NORIYUKI (JP)
ARAI YOSHITO (JP)
OGATA YUDAI (JP)
UCHIDA NORIYUKI (JP)
ARAI YOSHITO (JP)
Application Number:
PCT/JP2022/013048
Publication Date:
September 29, 2022
Filing Date:
March 22, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J11/08; C09J7/38; C09J133/06
Domestic Patent References:
| WO2013005470A1 | 2013-01-10 |
Foreign References:
| JPH10231325A | 1998-09-02 | |||
| JPH0770534A | 1995-03-14 | |||
| JP2020111741A | 2020-07-27 | |||
| JPS5846236B2 | 1983-10-14 | |||
| JP2015052050A | 2015-03-19 | |||
| JP2015021067A | 2015-02-02 | |||
| JP2015120876A | 2015-07-02 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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