Title:
ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2017/195711
Kind Code:
A1
Abstract:
An adhesive tape 100 for processing semiconductor substrates according to the present invention is characterized by comprising a base material 4 and an adhesion layer 2 stacked on one surface of the base material 4, wherein the base material 4 includes a notch layer 41 positioned so as to form the one surface side and an extension layer 42 stacked on the other surface to the notch layer 41, and the tack force of the extension layer 42 is 1-200 kPa at 80ºC. Accordingly, the present invention can provide an adhesive tape for processing semiconductor substrates that, at a dicing step, enables inhibition or prevention of fusion of the extension layer to a dicer table while enabling unerring prevention of occurrence of curving.
Inventors:
NAGAO YOSHINORI (JP)
Application Number:
PCT/JP2017/017293
Publication Date:
November 16, 2017
Filing Date:
May 02, 2017
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L21/301; C09J4/00; C09J7/20; C09J133/00
Foreign References:
| JP2016031996A | 2016-03-07 | |||
| JP2014216517A | 2014-11-17 | |||
| JP2007031535A | 2007-02-08 | |||
| JP2016021494A | 2016-02-04 | |||
| JP2007027474A | 2007-02-01 | |||
| JP2015088664A | 2015-05-07 |
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
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