Title:
ADHESIVE TAPE FOR SEMICONDUCTOR PROTECTION AND METHOD FOR PROCESSING SEMICONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2019/022050
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: an adhesive tape for semiconductor protection, which enables a circuit pattern on a semiconductor device to be perceived through the tape in cases where this adhesive tape is bonded to a circuit surface of the semiconductor device during a semiconductor production process, and which is capable of exhibiting high electrification suppressing performance even if subjected to a high temperature processing at 180°C or higher; and a method for processing a semiconductor, which uses this adhesive tape for semiconductor protection.
The present invention is an adhesive tape for semiconductor protection, which comprises an adhesive layer and a conductive layer that is laminated on one surface of the adhesive layer, and wherein: the surface resistivity on the adhesive layer side is from 1.0 × 104 Ω/□ to 9.9 × 1013 Ω/□ (inclusive) both before and after 6-hour heating at 180°C; and the visible light transmittance as measured from the conductive layer side is 30% or more.
More Like This:
| JPH09259945 | ANISOTROPIC CONDUCTIVE FILM TAPE |
| WO/2018/186271 | RESIN-METAL COMPOSITE MEMBER FOR TIRE, AND TIRE |
| JP2003089288 | DOUBLE POSTAL CARD AND MANUFACTURING METHOD THEREFOR |
Inventors:
TONEGAWA TORU (JP)
MASUZAWA KENJI (JP)
MASUZAWA KENJI (JP)
Application Number:
PCT/JP2018/027627
Publication Date:
January 31, 2019
Filing Date:
July 24, 2018
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J201/00; C09J7/38; H01L21/683
Domestic Patent References:
| WO2017110202A1 | 2017-06-29 |
Foreign References:
| JPH08245932A | 1996-09-24 | |||
| JP2002069395A | 2002-03-08 | |||
| JP2011210944A | 2011-10-20 | |||
| JPH04204446A | 1992-07-24 |
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
Download PDF: