Title:
ADHESIVE TAPE, SEMICONDUCTOR WAFER PROCESSING TAPE
Document Type and Number:
WIPO Patent Application WO/2022/186158
Kind Code:
A1
Abstract:
An adhesive tape that has a substrate layer and an adhesive layer that is provided on the substrate layer. At 23°C–150°C, the loss modulus G" of the adhesive layer is 1.0×102–1.6×105 Pa, and, at the same temperatures, the minimum value M1 of the difference (G'-G") between the storage modulus G' and the loss modulus G" of the adhesive layer is at least 1.0×105 Pa.
Inventors:
NAKAMURA CHIE (JP)
IIZUKA KAZUKI (JP)
TANAKA TOMOAKI (JP)
TOYA MASAHIRO (JP)
HASUMI MIZUKI (JP)
IIZUKA KAZUKI (JP)
TANAKA TOMOAKI (JP)
TOYA MASAHIRO (JP)
HASUMI MIZUKI (JP)
Application Number:
PCT/JP2022/008400
Publication Date:
September 09, 2022
Filing Date:
February 28, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C09J133/08; C09J7/38; H01L21/301
Foreign References:
| JP2002155249A | 2002-05-28 | |||
| JP2016225389A | 2016-12-28 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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