Title:
ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2018/216114
Kind Code:
A1
Abstract:
Provided is a thin adhesive tape which has an excellent balance between fixation to members and conformability to members and which includes a base material and an adhesive layer provided on one side of the base material, wherein the base material has a thickness of 2 to 25 μm, the adhesive layer has a thickness of 0.1 to 10 μm, the adhesive tape has a thickness of 30 μm or less, the adhesive tape has adhesion in accordance with JIS Z 0237:2000 of 0.50 N/10 mm or more, and the adhesive tape has a member rebound strength calculated by the following formula of 70 MPa∙mm or less.
Member rebound strength (MPa∙mm)=modulus of elongation (MPa) of adhesive tape × thickness (mm) of adhesive tape
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Inventors:
EDAHIRO TAKASHI (JP)
Application Number:
PCT/JP2017/019249
Publication Date:
November 29, 2018
Filing Date:
May 23, 2017
Export Citation:
Assignee:
TERAOKA SEISAKUSHO KK (JP)
International Classes:
C09J11/06; C09J123/00; C09J133/04
Domestic Patent References:
| WO2013133167A1 | 2013-09-12 | |||
| WO2014069356A1 | 2014-05-08 |
Foreign References:
| JP2013140765A | 2013-07-18 | |||
| JP2017008189A | 2017-01-12 | |||
| JP2013064086A | 2013-04-11 | |||
| JP2012072362A | 2012-04-12 | |||
| JP2017052835A | 2017-03-16 | |||
| JP2012226992A | 2012-11-15 | |||
| JP2015196832A | 2015-11-09 |
Attorney, Agent or Firm:
ISHIBASHI, Masayuki et al. (JP)
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